Abstract
The rapid proliferation of artificial intelligence applications is driving an unprecedented demand for efficient data centers tailored to meet the unique requirements of AI workloads. This presentation will delve into the intricate challenges and innovative solutions associated with constructing AI data centers from a component-level perspective.
Key technical hurdles encompass high-speed component integration and effective power management, both of which are essential for achieving the low latency and high bandwidth that AI tasks demand. We will explore the complexities surrounding semiconductor technology, interconnect design, and power integrity techniques, highlighting how advancements in these areas can facilitate optimal performance.
Moreover, the substantial energy consumption inherent in AI data centers poses significant challenges that necessitate the implementation of efficient power conversion and management strategies to ensure operational sustainability.
We will discuss cutting-edge approaches to electromagnetic compatibility (EMC) and rigorous testing methodologies, emphasizing their critical role in the successful deployment of AI infrastructure. This presentation aims to provide a comprehensive overview of the evolving landscape of AI data centers and the engineering innovations driving their development.
Biography
Dr. Philipp Weigell is the Vice President of the Market Segment Industry, Components, Research, and Universities at Rohde & Schwarz. With a strong focus on high-speed digital technologies and the semiconductor ecosystem, he is dedicated to advancing innovation in these critical areas.
Holding a PhD in Physics from the Technical University of Munich, Dr. Weigell has a robust background in instrumentation and measurement technology. His expertise is particularly relevant to the growing demands of AI data centers, where high-speed digital compliance testing and efficient power management are essential for optimal performance.